Routers, Controllers, and Set-top Boxes

Routers, Controllers, and Set-top Boxes

1. Application of SMT and DIP Production Line

With the continuous development and progress of technology, more and more consumer electronic products need to be produced through SMT Solution and DIP Solution. These products include routers, controllers, and set-top boxes, which play very important roles in modern society.

The demand for high quality, high efficiency, and high productivity in today's electronic products market continues to increase. In order to meet the market demand, manufacturers must constantly improve their production processes. The close coordination and connection between SMT and DIP processes is one of the necessary conditions to achieve high quality, efficiency, and productivity.

The manufacturing process of products such as routers, controllers, and set-top boxes can be divided into two main stages: the SMT production line and the DIP production line. The SMT production line is mainly responsible for the installation of surface mount components on the circuit board, while the DIP production line is responsible for the installation of through-hole components. The close collaboration and cooperation between the two are key to ensuring product quality and production efficiency.

1. The Difference Between SMT Production Line and DIP Production Line

SMT (Surface Mount Technology) production line and DIP (Dual In-line Package) production line are two different production lines in the electronic component manufacturing process.

The SMT production line completes assembly by directly mounting electronic components such as resistors, capacitors, and transistors onto the surface of a printed circuit board (PCB). This technology significantly improves production efficiency and assembly accuracy, while reducing assembly volume and weight. The SMT production line typically includes equipment such as PCB Printing Machine, PCB Pick and Place Machine, PCB Reflow Oven, SMT AOI.

The DIP production line inserts components into pre-drilled holes on the printed circuit board and then performs soldering. This technology used to be the main assembly method in the past but has gradually been replaced in modern electronics manufacturing. The DIP production line typically includes equipment such as an Automatic Insertion Line and a Wave Soldering Machine.

2. SMT Process

Solder Paste (Red Glue) Printing --> Components Placement --> Reflow Soldering --> AOI Optical Inspection

3. SMT Prodution Line Solution

1 operator to oversee the entire production line, 1 assistant, totaling 2 personnel.

- SMT Magazine Loader
- Full-auto SMT Stencil Printer
- 3D SPI
- SMT Conveyor
- 2 sets SMT Chip Mounter
- PCB Conveyor
- SMT Reflow Soldering Oven (10-12 zones)
- PCB Cooling Conveyor
- On-line SMT AOI
- NG/OK Unloader

1. SMT Magazine Loader: responsible for the first step of feeding the circuit board into the production line, can achieve fast and accurate board loading operation.
2. Full-auto SMT Stencil Printer: evenly applies solder paste on the circuit board to ensure a more secure connection between electronic components.
3. 3D SPI: used to inspect whether the solder paste is evenly applied and to detect any defects, ensuring the quality of the pick-and-place process.
4. SMT Conveyor: serves as a bridge between various equipment and transfers the circuit board from one equipment to another.
5. SMT Chip Mounter: precisely place electronic components on the circuit board to achieve the functionality of the circuit board.
6. SMT Reflow Soldering Oven: heats and cools the solder joints to make the connection between electronic components and the circuit board more secure.
7. PCB Cooling Conveyor: cools the circuit board after reflow soldering and prepares it for the next step.
8. Online SMT AOI: uses high-resolution cameras to inspect whether the electronic components on the circuit board are correctly installed and connected, and whether there are any defects.
9. NG/OK Unloader: categorizes the inspected circuit boards as good or bad for further processing or repair.

These SMT Machines can work efficiently together and produce high-quality routers, controllers, and set-top boxes in a short period of time, ensuring product quality and yield while reducing production costs.

If you are interested in our SMT equipment and solutions, please contact us, and we will provide you with more detailed information.

4. DIP Process

Plug-in --> Soldering --> Maintenance --> PCB depaneling machine.

On the other hand, the DIP production line is a technology used to manufacture double-sided through-hole printed circuit boards. In the DIP production line, components need to be manually inserted into the predetermined positions on the circuit board and then fixed through soldering techniques. The main equipment in the DIP production line includes a pin-type insertion machine, Wave Soldering Machine, and so on.

In the production of mobile phones, tablets, and Android set-top boxes, the DIP production line is mainly used to manufacture a small number of components on the circuit board, such as sensors, connectors, and so on. Although the DIP production line requires more manual operations, it is still essential in the manufacturing of mobile phones, tablets, and Android set-top boxes because it can meet some process requirements that SMT production lines cannot complete.

5. DIP Prodution Line Solution

Personnel are adjusted according to the product, 8-20 people

After the surface-mounted components are installed, the PCB needs to enter the DIP production line. In the DIP production line, plug-in components such as IC chips and sockets are inserted into the PCB with the surface-mounted components already installed. Plug-in components are relatively large components that cannot be accurately installed on the PCB using SMT technology, so they need to be manually inserted.

6. SMT Production Line and DIP Line Layout

7. SMT Solution Data

SMT Capacity Evaluation 2 sets pick and place machine;  production capacity 35,000-45,000CHIP/H
Total Power 80 KW Operating Power 17KW
Applicable Product SMD components within 100pcs, 0201-45mm, max PCB width 350mm
DIP Capacity Evaluation Calculated based on the number of componens and the operators
Total Power 35.5 KW
Operating Power 10.5 KW
Applicable Product Medium and high-end products requirements, Max PCB width 350mm
Workshop Size L30m x W15m , total area 450 ㎡

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