Why Choose the Solder Paste Jetting Machine?

In today's tech-driven world, the demand for smaller electronic devices is skyrocketing. Manufacturers are turning to the solder paste jetting machine for efficient solutions. These machines offer precision, automation, and quality control, crucial for modern electronics production. With features like XY linear motor drive control, the I.C.T-HD330 High-Precision Solder Paste Jetting Machine from Japan sets new standards for efficiency and accuracy. Its versatility spans various industries, backed by I.C.T's commitment to excellence and exceptional service.

Meeting Diverse Manufacturing Needs with the Solder Paste Jetting Machine

The solder paste jetting machine offers flexibility and precision, tailored to diverse manufacturing needs. Rapid customization and automatic needle height compensation enhance productivity and consistency. Features like non-contact laser detection and high-speed micro-spraying ensure attention to detail and versatility. With precision solder paste printing capabilities, this machine excels across semiconductor packages, LED back-end assemblies, and more.

Advantages of the Solder Paste Jetting Machine Parameters

Minimum Dispensing Quantity:

The automatic solder paste jet printer machine excels in dispensing even the smallest quantities of solder paste, ensuring meticulous application for consistent results.

Dispensing Accuracy:

With exceptional accuracy reaching ±1 micron, the solder paste jetting machine guarantees precise and repeatable solder paste deposition, enhancing product quality.

Dispensing Speed:

Operating at a speed of 1500mm/sec, the machine offers swift and efficient dispensing without compromising accuracy, optimizing productivity.

Minimum Printable Dot Diameter:

Capable of printing dot diameters as small as 110 microns, the machine ensures intricate patterns and fine features with exceptional precision.

Image Processing Speed:

Its lightning-fast image processing speeds enable real-time detection and compensation for deviations, ensuring consistent dispensing accuracy.

Exploring the Solder Paste Jetting Machine's Intriguing Features

Efficiency of the I.C.T-HD330

The solder paste jetting machine achieves dynamic positional accuracy within ±3 microns, ensuring uniform coating application and minimizing solder paste consumption.

Height Compensation Mechanism in the I.C.T-HD330

Utilizing a laser height measurement system, the machine guarantees precise height compensation, enabling consistent solder paste deposition across diverse PCB surfaces.

Choosing Dispensing Volume in the Solder Paste Jetting Machine

Selection of dispensing volume considers factors such as component size, material, and dispensing requirements, ensuring optimal performance and avoiding over-dispensing.

Reducing Solder Paste Overlapping: Dual Compensation Mechanism

By automatically compensating for deviations in chip position and height, the machine minimizes solder paste overlapping, optimizing quality and minimizing waste.

Dual Compensation for Path and Volume: How Does the Solder Paste Jetting Machine Achieve It?

The machine achieves dual compensation for path and volume through automatic detection and adjustment mechanisms, ensuring precise solder paste deposition.

Reliable After-Sales Support for Your Solder Paste Jetting Machine

Manufactured in Japan, the solder paste jetting machine comes with professional technical support and training, ensuring proficient operation and maintenance. With comprehensive services and a steady supply of spare parts, clients can trust in I.C.T beyond the purchase.